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HP Probook 5310M

ecurity Classification 2005/03/10 Issued Date Deciphered Date 2006/03/10 THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENTIAL AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRANSFERED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS, INC. NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS MAY BE USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS, INC. A Title Compal Electronics, Inc. Notes List Size Document Number Custom LA-5221P Date: Tuesday, February 03, 2009 R ev 0.1 Sheet 3 of 45 5 4 3 2 1 XDP Connector +VCCP XDP_TDI TP13 TP14 XDP_BPM#1 XDP_BPM#0 PAD 54.9_0402_1% R4 1 2 54.9_0402_1% XDP_HOOK1 TP16 D TP22 PAD 54.9_0402_1% 2 R5 1 2 @ 54.9_0402_1% R6 1 2 54.9_0402_1% XDP_TCK PAD PAD 2 1 XDP_BPM#5 XDP_BPM#3 XDP_BPM#2 R3 XDP_TRST# TP11 TP12 2 1 R7 1 2 54.9_0402_1% XDP_BPM#4 PAD PAD 1 R2 XDP_TDO TP10 54.9_0402_1% XDP_TMS PAD R1 Place close to U1. PAD +VCCP TP15 TP17 PAD This shall place near CPU TP18 PAD U1A <20> H_STPCLK# <20> H_INTR <20> H_NMI <20> H_SMI# F8 C9 C5 E5 H_INIT# 2 1 TP20 <20> H_LOCK# <8> G5 K2 H4 K4 L1 XDP_DBRESET# @ PAD HIT# HITM# XDP_PRE# TP21 1 R12 0_0402_5% 2 H_RESET# <8> H_RS#0 H_RS#1 H_RS#2 H_TRDY# <8> <8> <8> <8> PWM Fan Control circuit H_HIT# <8> H_HITM# <8> XDP_BPM#0 XDP_BPM#1 XDP_BPM#2 XDP_BPM#3 XDP_BPM#4 XDP_BPM#5_R XDP_TCK XDP_TDI XDP_TDO XDP_TMS XDP_TRST# XDP_DBRESET# R13 0_0402_5% 1 2 C 12/22 Follow consumer design +5VS XDP_BPM#5 0_0603_5% R892 XDP_DBRESET# <21> 2 BPM[0]# BPM[1]# BPM[2]# BPM[3]# PRDY# PREQ# TCK TDI TDO TMS TRST# DBR# H_RESET# H2 F2 AY8 BA7 BA5 AY2 AV10 AV2 AV4 AW7 AU1 AW5 AV8 J7 PAD 1 IERR# INIT# PROCHOT# THERMDA THERMDC THERMTRIP# D38 BB34 BD34 B10 H_PROCHOT# R14 H_THERMTRIP# 1 +3VS +VCCP 2 68_0402_5% <32> BCLK[0] BCLK[1] A35 C35 1 FAN_PWM_R 1 3K_0402_5% 2 2 R890 FAN_PWM H_THERMTRIP# <8,20> H_THERMDA, H_THERMDC routing together, Trace width / Spacing = 10 / 10 mil H CLK C3 1 H_THERMDA H_THERMDC 5 Place Close to U1. THERMAL U50 INB O 4 2 R891 INA TC7SH00FU_SSOP5 1 2.2K_0402_5% 2 @ 0.1U_0402_10V6K JP2 1 1 2 2 G1 3 3 G2 for RF, HP 12/10 4 5 ACES_85204-03001 conn@ +3VS +VCCP CLK_CPU_BCLK <15> CLK_CPU_BCLK# <15> R896 10K_0402_5% 01/11 HP review Del R15 and R16(short short net) Q21 H_PROCHOT# B 3 C <42> H_PROCHOT# E RSVD01 RSVD02 RSVD03 RSVD04 RSVD05 RSVD06 RSVD07 1 PMBT3904_SOT23 External Thermal Sensor EMC1402 PENRYN SFF_UFCBGA956 ULV723@ +3VS C4 0.1U_0402_16V4Z 2 1 U2 1 C5 2200P_0402_50V7K H_THERMDA 2 2 H_THERMDC 1 3 4 A MAINPWON 1 R18 H_THERMTRIP# 2006/02/13 Issued Date 2 @ 0_0402_5% VDD SMCLK DP SMDATA DN ALERT# THERM# GND 3 ICH_SM_CLK <14,15,21,25> 7 ICH_SM_DA <14,15,21,25> 6 THERM_SCI# <21> 5 1 R17 2 10K_0402_5% +3VS A EMC1402-1-ACZL-TR_MSOP8 Put the sensor colse to CPU 2006/03/10 Deciphered Date THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENTIAL AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRANSFERED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS, INC. NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS MAY BE USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS, INC. 4 8 Compal Secret Data Security Classification 5 H_RESET# 2 1K_0402_5% <8> N1 1 2 R9 56_0402_5% CONTROL H_BR0# B40 D8 CLK_CPU_XDP <15> CLK_CPU_XDP# <15> H_RESET#_R 1 R11 B 12/22 HP review Remove test point STPCLK# LINT0 LINT1 SMI# M2 BR0# RESERVED V2 Y2 AG5 AL5 J9 F4 H8 B A[17]# A[18]