Платформа установлена в:

HP Probook 5310M

CFG_11 CFG_12 CFG_13 CFG_14 CFG_15 CFG_16 CFG_17 CFG_18 CFG_19 CFG_20 PM_EXTTS#0 R52 1 2 10K_0402_5% SM_RCOMP SM_RCOMP# SM_RCOMP_VOH SM_RCOMP_VOL SM_VREF SM_PWROK SM_REXT SM_DRAMRST# PEG_CLK PEG_CLK# PM_SYNC# PM_DPRSTP# PM_EXT_TS#_0 PM_EXT_TS#_1 PWROK RSTIN# THERMTRIP# DPRSLPVR A7 A49 A52 A54 B54 D55 G55 BE55 BH55 BK55 BK54 BL54 BL52 BL49 BL7 BL4 BL2 BK2 BK1 BH1 BE1 G1 NC_1 NC_2 NC_3 NC_4 NC_5 NC_6 NC_7 NC_8 NC_9 NC_10 NC_11 NC_12 NC_13 NC_14 NC_15 NC_16 NC_17 NC_18 NC_19 NC_20 NC_21 NC_22 4 2006/02/13 3 BL25 BK26 SMRCOMP SMRCOMP# BK32 BL31 V_DDR_MCH_REF SM_PWROK SM_REXT SM_DRAMRST# +1.5V SMRCOMP_VOH SMRCOMP_VOL BC51 AY37 BH20 BA37 <14> <14> R32 R33 1 1 2 80.6_0402_1% 2 80.6_0402_1% R35 R36 1 1 2 10K_0402_1% 2 499_0402_1% SM_DRAMRST# <14> B42 D42 B50 D50 CLK_MCH_DREFCLK <15> CLK_MCH_DREFCLK# <15> MCH_SSCDREFCLK <15> MCH_SSCDREFCLK# <15> R49 P50 CLK_MCH_3GPLL <15> CLK_MCH_3GPLL# <15> AG55 AL49 AH54 AL47 DMI_TXN0 DMI_TXN1 DMI_TXN2 DMI_TXN3 <21> <21> <21> <21> AG53 AK50 AH52 AL45 DMI_TXP0 DMI_TXP1 DMI_TXP2 DMI_TXP3 <21> <21> <21> <21> AG49 AJ49 AJ47 AG47 DMI_RXN0 DMI_RXN1 DMI_RXN2 DMI_RXN3 <21> <21> <21> <21> AF50 AH50 AJ45 AG45 DMI_RXP0 DMI_RXP1 DMI_RXP2 DMI_RXP3 <21> <21> <21> <21> G33 G37 F38 F36 G35 DFGT_VID_0 DFGT_VID_1 DFGT_VID_2 DFGT_VID_3 DFGT_VID_4 C DMI_RXN_0 DMI_RXN_1 DMI_RXN_2 DMI_RXN_3 DMI_TXN_0 DMI_TXN_1 DMI_TXN_2 DMI_TXN_3 DMI_TXP_0 DMI_TXP_1 DMI_TXP_2 DMI_TXP_3 GFX_VID_0 GFX_VID_1 GFX_VID_2 GFX_VID_3 GFX_VID_4 GFX_VR_EN CL_CLK CL_DATA CL_PWROK CL_RST# CL_VREF G39 <44> <44> <44> <44> <44> B 12/12 HP review +1.05VM-->+VCCP GFXVR_EN <44> +VCCP AK52 AK54 AW40 AL53 AL55 R41 1K_0402_1% CL_CLK0 <21> CL_DATA0 <21> PM_PWROK <21,32,42> CL_RST# <21> CL_VREF C77 DDPC_CTRLCLK DDPC_CTRLDATA SDVO_CTRLCLK SDVO_CTRLDATA CLKREQ# ICH_SYNC# TSATN# HDA_BCLK HDA_RST# HDA_SDI HDA_SDO HDA_SYNC CANTIGA GMCH SFF_FCBGA1363 2006/03/10 Deciphered Date THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENTIAL AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRANSFERED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS, INC. NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS MAY BE USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS, INC. 5 02/02 DDR3 power F34 F32 B38 A37 C31 K42 D10 0.1U_0402_16V4Z 2 1 R42 511_0402_1% 2 CLKREQ#_B <15> MCH_ICH_SYNC# <21> TSATN# R47 1 2 54.9_0402_1% +VCCP A C29 B30 D28 A27 B28 Compal Secret Data Security Classification Issued Date M_ODT0 M_ODT1 DMI_RXP_0 DMI_RXP_1 DMI_RXP_2 DMI_RXP_3 +3VS 2 BJ17 BJ19 BC17 BE17 1 layout note: CFG20 DDR_CS0_DIMMA# <14> DDR_CS1_DIMMA# <14> D 1 <4,20> H_THERMTRIP# <21,42> PM_DPRSLPVR <14> PM_EXTTS#0 R38 <21,32,42> PM_PWROK R39 <19,23,25,31> PLT_RST# 1 2 R40 0_0402_5% 1 1 1 <21> PM_BMBUSY# <5,20,42> H_DPRSTP# 01/05 HP review Del PM_EXTTS#0 and contact J39 L39 R45 R50 0.01U_0402_25V7K <10> BK18 BK16 BE23 BC19 SA_ODT_0 SA_ODT_1 SB_ODT_0 SB_ODT_1 CLK <4> <4> <4> DDR_CKE0_DIMMA <14> DDR_CKE1_DIMMA <14> SA_CS#_0 SA_CS#_1 SB_CS#_0 SB_CS#_1 DMI H_RS#0 H_RS#1 H_RS#2 BC35 BE33 BE37 BC37 SA_CKE_0 SA_CKE_1 SB_CKE_0 SB_CKE_1 GRAPHICS VID F4 F2 G7 M_CLK_DDR#0 <14> M_CLK_DDR#1 <14> 2 <4> <4> <4> <4> <4> K26 G23 G25 J25 L25 L27 F24 D24 D26 J23 B26 A23 C23 B24 B22 K24 C25 L23 L33 K32 K34 12/29 HP review Remove some CFG net R43 10K_0402_1% 0.1U_0402_16V4Z R49 100_0402_1% 2 1 0.1U_0402_16V4Z 24.9_0402_1% 2 1 1K_0402_1% 1 2 1 R48 2 2K_